C-300-MCU-T-H
HEAT - RESISTANT SHIELDING TAPE (masking)
C-300-MCU-M-H
HEAT - RESISTANT SHIELDING TAPE (masking)
Catalogue View
| Product No. | RoHS | Remarks | Code | Ask Price | 2D | 3D |
|---|---|---|---|---|---|---|
| C-300-MCU-T13-H |
|
30m | 24538 | |||
| C-300-MCU-T25-H |
|
30m | 24537 | |||
| C-300-MCU-M4-H |
|
For M4 | 24539 | |||
| C-300-MCU-M5-H |
|
For M5 | 24540 | |||
| C-300-MCU-M6-H |
|
For M6 | 24541 | |||
| C-300-MCU-M8-H |
|
For M8 | 24542 |
Features
-
C-300-MCU-M-H
- Can be used when applying a powder coating, etc. in a high-temperature compartment.
- Tin-plated copper foil with masking tape.
- Saves you the trouble of applying conductivity treatments (plating or conductive coating) to a casing or housing.
- Following application, simply peel the masking tape away from the tin-plated copper foil surface.
- After masking tape removal, the tin-plated copper foil can be used as a conducting surface.
- Uses electrically conductive adhesive to minimize any shielding effect.
- Easy handling and application.
- Characteristics are the same as for C-300-MCU-T-H.
-
C-300-MCU-T-H
- Can be used when applying a powder coating, etc. in a high-temperature compartment.
- Tin-plated copper foil with masking tape.
- Saves you the trouble of applying conductivity treatments (plating or conductive coating) to a casing or housing.
- Following application, simply peel the masking tape away from the tin-plated copper foil surface.
- After masking tape removal, the tin-plated copper foil can be used as a conducting surface.
- Uses electrically conductive adhesive to minimize any shielding effect.
- Easy handling and application.
Specifications
-
C-300-MCU-M-H
- One sheet: 10pcs
-
C-300-MCU-T-H
- One roll: 30m
Specific Use
- Grounding/shielding for cases/housings
- Masks during painting and prevents casing corrosion.
Remarks
- Can also be made as a cut product and in irregular shapes.
