Features

C-300-MCU-M

• Tin-plated copper foil with masking tape.
• Saves you the trouble of applying conductivity treatments (plating or conductive coating) to a casing or housing.
• Following application, simply peel the masking tape away from the tin-plated copper foil surface.
• After masking tape removal, the tin-plated copper foil can be used as a conducting surface.
• Uses electrically conductive adhesive to minimize any shielding effect.
• Easy handling and application.
• Characteristics are the same as for C-300-MCU-T.

C-300-MCU-T

• Tin-plated copper foil with masking tape.
• Saves you the trouble of applying conductivity treatments (plating or conductive coating) to a casing or housing.
• Following application, simply peel the masking tape away from the tin-plated copper foil surface.
• After masking tape removal, the tin-plated copper foil can be used as a conducting surface.
• Uses electrically conductive adhesive to minimize any shielding effect.
• Easy handling and application.